Please Join Us For a Great Italian Dinner to Honor John Reinert 2025 Winner of the John Meredith Region 5 Lifetime Achievement Award at the Downtown Panino's Restaurant on Tuesday, May 27 6 pm.
David Bondurant will do a talk on the latest packaging technology for High Performance & AI Processors:
“If we make them smaller, we can make them faster” has been the approach to building faster computers over the last 70-years starting with the first transistors and continuing as we built increasingly more complex integrated circuits. More recently we have gone Beyond Moore’s Law to fabricate advanced supercomputers and AI computers using 3D Memory and 3D Packaging. In this talk, I review recent trends in 3D Memory and 3D Packaging which are driving these high performance system towards wafer scale systems with multiple reticle sized processors and 3D memories. We observe the next generation HBM4, high bandwidth 3D DRAM, and the emergence of the HBF, high bandwidth Flash memory, to increase memory capacity to serve larger databases.
Speaker(s): David Bondurant,
Agenda:
Dinner
Award Presentation
Presentation
Bldg: The Downtown Panino's, 604 North Tejon Street, Colorado Springs, Colorado, United States, 80903, Virtual: https://events.vtools.ieee.org/m/485191